ChipMOS has a leading position in the field of semiconductor packaging and testing, and its LCD driver IC packaging and testing capacity ranked 2nd in the world. ChipMOS strengthens vertical integration operations and customer relations with ciMes production management modules, and uses the core competition advantages fully to expand global layout.
Nation Applied Research Laboratories support academic development of advanced semiconductor process technology research and train semiconductor-related personnel. With ciMes, they established a data management platform, simplified unit-applying operation and digitalized data management for centralized information management.
PSC provides dynamic random memory access (DRAM) and wafer manufacturing. With OCAPS module as foundation, ciMes provides a customized production line abnormal solution system.
MSEC is a semiconductor packaging and testing firm. With the implementing of ciMes, MESC sees its quality improved with greater reputation.
Pricelon is a professional IC design company. With ciMes implementation, the company thoroughly provides different clients with production information and undertakes analysis management for better satisfaction of customer needs.
AiPC is a photo-mask manufacturing company. With ciMes (WIP, MMC and SPC modules), the production records for all its factories become connected and information along production lines are all connected, allowing its production to run smoothly.
HeJian is a professional wafer foundry company. With ciMes system, its back-end semiconductor production total solution is made complete while it can also provide customization from a full flip-chip packing experience.
LCOS mainly produces digital silicon crystal display rear projection TVs. With ciMes, LCOS can access information from upper, middle, and lower streams without a problem.